Decidamp SP450

water based vibration damping compound for interior rail applications

Decidamp® is a fast drying, water based viscoelastic vibration damping compound.

Optimised to suit transport and industrial applications, the advanced formula was developed for acoustic improvement of structures that are exposed to vibration and impact sound.

Decidamp damping compound is a lightweight, non-hazardous structural damping material that is suitable for interior use with easy application by simply spraying, rolling or trowelling onto surfaces. Once dry, the cured film is chip resistant and exhibits low combustibility, it effectively absorbs and dissipates vibrational energy from the flexural stress of the base structure and reduces panel coincidence dip and resonance effects.

An advanced extensional damping compound, it is suitable for application to structures (fibreglass, aluminium, and steel, including stainless steel) where sound damping is required. Compliance to the latest international fire rail regulations, such as EN45545, makes it the ideal choice for interior transport applications.

Decidamp® SP450

Technical data

Optimised to suit transport and industrial applications, the advanced formula was developed for acoustic improvement of structures that are exposed to vibration and sound impact.

Please refer to the Technical Data Sheet (TDS) for more information.

Applications

  • Rail: carriages, body panels, locomotive, cabin walls and roofing, shells and flooring
  • Machinery or industrial enclosures
  • HVAC applications, plant rooms, substations
  • Automotive, trucks and bus underbodies
  • Exit ways, smoking areas, stairwells

Features

  • Compliance to EN45545

  • Advanced, non-sag formulation
  • Excellent adhesion to fibreglass, aluminium, and steel - including stainless steel
  • Water based
  • Reduces vibrational structural wear/tear
  • Reduce noise and dynamic stress
  • Excellent flame resistance, ignition retardant
  • Broad temperature and frequency range
  • Ideal for weight sensitive applications - lightweight
  • High chip resistance